The CC2564C device from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI level solution, providing high performance and robust Bluetooth solution. Based on TI’s seventh-generation Bluetooth core, the CC2564C device provides a product-proven solution that is Bluetooth 5.1-compliant, adding LE security and enhancing support for complex topologies (dual mode and link layer topologies). This HCI device offers best-in-class RF performance with about twice the throughput of other Bluetooth low-energy solutions, and includes a royalty-free software stack compatible with several host MCUs and MPUs, for a complete Bluetooth solution. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR, EDR, and low energy modes of operation.
Parameters :
Features :
- TI’s Single-Chip Bluetooth® Solution With Bluetooth Basic Rate (BR), Enhanced Data Rate (EDR), and Low Energy (LE) Support
- Bluetooth 5.1 Delaration ID D049226
- Highly Optimized for Size-Constrained and Low-Cost Designs:
- Single-Ended 50-Ω RF Interface
- VQFNP-MR Package Family, RVM Footprint: 76 Terminals, 0.6-mm Pitch, 8-mm × 8-mm
- BR and EDR Features Include:
- Up to Seven Active Devices
- Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
- Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
- Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, Modified Subband Coding (mSBC), and Transparent (Uncoded)
- Provide an Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
- Support of Multiple Bluetooth Profiles With Enhanced QoS
- Low Energy Features Include:
- Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
- Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
- Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
- Capabilities of Link Layer Topology Scatternet—Can Act Concurrently as Peripheral and Central
- Network Support for up to 10 Devices
- Time Line Optimization Algorithms to Achieve Maximum Channel Utliization
- Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
- Class 1 TX Power up to +12 dBm
- Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
- Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
- Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
- Advanced Power Management for Extended Battery Life and Ease of Design
- On-Chip Power Management, Including Direct Connection to Battery
- Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
- Shutdown and Sleep Modes to Minimize Power Consumption
- Physical Interfaces:
- UART Interface With Support for Maximum Bluetooth Data Rates
- UART Transport Layer (H4) With Maximum Rate of 4 Mbps
- Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
- Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface
- UART Interface With Support for Maximum Bluetooth Data Rates
- Flexibility for Easy Stack Integration and Validation Into MCUs and MPUs
- HCI Tester Tool to Evaluate RF Performance of the Device and Configure Service Pack
